The first European Solid-State Device Research Conference (ESSDERC) conference was organized in 1971 in Munich, Germany, aiming to present the latest developments in physics, technology and characterization of solid- state devices and bringing together both the academic world and the industry active on silicon and compound semiconductor integrated circuits.

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In 1975, the initiative was taken to start up a sister conference, European Solid-State Circuits Conference (ESSCIRC) focusing on recent advances in design concepts, design methodologies, circuit simulation and solid-state circuits. Since the last decade there is a worldwide trend towards education, academic research and industrial development that strengthens the link between device technology and circuit design. This stems from the need to reconcile system, circuit and technology R&D in a world that needs ever more advanced, complex applications implemented in ever more advanced, powerful technologies. Consequently, Designers and technologists must closely collaborate. Only when both disciplines and skills go hand in hand, optimal solutions will be achieved. To cope with this important trend, the ESSDERC/ESSCIRC Steering Committee (EStC) recently decided to reorganize the conferences into a single conference format under a new name.

The last ESSDERC/ESSCIRC conference took place in Lisbon, Portugal, September 11-14, 2023.

The first “European Solid-State Electronics Research Conference - ESSERC” is scheduled for Bruges, Belgium, September 9-12, 2024.

The historical link with both ESSDERC and ESSCIRC remains and is also reflected in the new logo and the fact that the conference in Bruges will be referenced as the 50th ESSERC Conference. ESSERC has a single Technical Program Committee, a coordinating Steering Committee, a Conference Chair and Co-Chair and three Track Chairs, i.e., one for Circuits, one for Technologies and one for a Joint Track.

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The aim of ESSERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits. The level of integration for system-on-chip design is rapidly increasing. This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers and system designers is necessary.