​09:30 - 09:40

Horizon Europe ICOS-International Cooperation on Semiconductors, and INPACE-Indo-Pacific-European Hub for Digital Partnerships

Francis Balestra (Grenoble INP, FR)

International cooperation is key for speeding up technological innovation and to boost the resilience of the semiconductor value chains, which is one of the objectives of the EU Chips Act. This SINANO/ICOS/INPACE workshop will deal with the presentation of emerging technologies in advanced computation, advanced functionalities and ground-breaking technologies and the expected impact for international cooperation. It is supported by the European SiNANO Institute, which is the European representative of the International IEEE IRDS Roadmap, and by Horizon Europe projects ICOS, dedicated to International Cooperation on Semiconductors, and INPACE, devoted to EU-Indo-Pacific Digital Partnerships. 

 

09:40 - 10:00

Smart Sensors for IoT

Alan O’Riordan (Tyndall, IE)

According to some estimates, there will be 24 billion interconnected devices by 2050, meaning almost every object around us will be connected to the Internet: streetlights, thermostats, electric meters, fitness trackers, water pumps, cars, elevators, even gym vests. The IoT market size is expected to reach $1.6 trillion by 2025, with a compound annual growth rate (CAGR) of 24.9% from 2020 to 20255. The IoT market is highly competitive and fragmented, with many large and small players operating in different segments and regions. Some of the largest IoT companies in the world by 2022 revenue include Apple Google Bosch Siemens etc all of whom are investing billions of dollars into IoT technologies. This talk will review some of the major players in Smart Sensors and Systems by technology, and region looking at the main leading Institutions in different countries and the opportunities for future international research cooperation.

 

10:00 - 10:20

Energy Harvesting for Autonomous Systems

Gustavo Ardila (University Grenoble-Alpes, FR)

Providing energetic autonomy to electronic devices will be a key factor in booming technologies like sensor networks and IoTs. This is true in particular in applications with specific requirements, where simple batteries would not be sufficient or where power cords cannot be used. Different wasted energy sources can be exploited and converted into electricity and provide energy to small electronic devices (e.g. sun or artificial light, heat, RF power, mechanical movements, etc.) but the converted energy need to be used wisely (e.g. powering sensors, etc.). Thus, power management circuits and energy storage devices are also important elements. This presentation will highlight the most promising technologies in the IRDS roadmap on Energy Harvesting and will gather an overview of the main EU and International activities in leading countries in this field. 

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10:20 - 10:40

Innovative Materials for Power Devices

Markus Pfeffer (Fraunhofer IISB, DE)

As outlined in the workshop announcement, international cooperation is key to accelerating technological innovation. This is also of utmost importance for research and development in the field of smart energy. In the Smart Energy part of this workshop, we will provide an overview of the main EU and international activities in leading countries in the field of semiconductors used for future technologies in this specific area. Various devices for industrial and automotive applications are already on the market. However, cost pressures and technological innovation are driving device performance to the next level. We will highlight the research needs and gaps identified to make further progress in the field of smart energy.

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10:40 - 11:00

Scaling Semiconductor Photonics – The Trends and the Challenges

Wim Bogaerts (Ghent University-IMEC, Photonics Research Group, BE)

Photonic integrated circuits (PIC) combine many optical functionalities on the surface of a chip, fabricated using the same technologies as used for microelectronics. PICs have become a major enabler for optical communication, first in long-haul fiber-optic telecom systems, and more recently in datacenter links. But even with this crucial role in our current internet infrastructure, PIC technology is still in its early days, comparable to electronics in the late 1980s or early 1990s. To become really impactful, Photonic chips need to scale in multiple aspects, and the emerging trends today are paving the way for this scaling. First of all, we need to enable more complex photonic circuit architectures, and support their design, fabrication, packaging and control. The overall performance of the on-chip building blocks also needs to improve, and this often requires new materials, just like the introduction of copper interconnects, high-k dielectrics and strained silicon boosted electronics. Photonics also needs to break out of its narrow market of optical communication: new demonstrations in sensing, spectrometry, diagnostics, LiDAR and quantum processing will scale the addressable market, and thus the production volumes needed to bring down the cost. But extending to other markets also pushes demand for even more variety in materials, as different applications require the use of different optical wavelengths

 

11:00 - 11:30

Coffee break

 

11:30 - 11:55

Emerging Semiconductors Meet New Applications: Security, Multi-Valued Computing, and Hazard Monitoring

Hocheon Yoo (Gachon University, KR)

Since its proposal by Dr. Dawon Kahng and Dr. Mohamed M. Atalla in 1959, the metal-oxide-semiconductor field-effect transistor (MOSFET) has played a crucial role in modern electronic devices. It has found widespread use in processors, image sensors, memories, and various other applications. However, the scaling of MOSFETs is currently encountering physical limitations, leading to challenges such as low process yields and problems arising from short-channel effects. As a result, there is an increasing demand for next-generation semiconductor devices. In this talk, we propose an approach called "Material-Device-Application Co-Consideration" for developing new applications. This approach involves bottom-up processes that leverage emerging materials. Specifically, we will focus on our recent efforts in the development of multi-valued logic (MVL) by controlling negative differential transconductance (NDT). We will also discuss the utilization of atomically-thin graphene and self-assembled monolayers in the creation of physically unclonable functions (PUFs) for information security. Furthermore, we will explore deep ultraviolet (DUV) region (280 nm – 200 nm)-based emerging applications: (i) partial discharge detection, (ii) flame sensing for fire monitoring and (iii) blood component identification. These topics will be covered in-depth during the presentation.

 

11:55 - 12:15

New Nanodevices Architectures

Nadine Collaert (imec, BE)

This presentation outlines key technological advancements in advanced compute. Beginning with an overview of current trends and challenges, we will look into the computing roadmap, analyzing new CMOS device architectures, emerging materials for FEOL and BEOL, the emergence of CMOS 2.0, next to innovations in memory technologies. We will also assess heterogeneous integration, from chiplets to functional backside, offering technical insights poised to reshape computational paradigms.

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12:15 - 12:35

Beyond Von Neumann Computing Architectures and Heterogeneous Integration

Olivier Faynot (CEA-LETI, FR)

With the recent COVID-19 crisis, the importance of Semiconductor technologies has been evidenced, increasing significantly the interest of all the countries due to its impact on sovereignty. Each country launched its own initiative to strengthen its position in Semiconductor. Many organizations all around the world are proposing new solutions for advanced computing.  Many options, including disruptive approaches, are investigated in order to provide new solutions for competitive technologies. This talk will detail the main actors and the main solutions that are developed for the next generations of Advanced Computing technologies. Details of the main leading actors (research organizations, universities, industries) will be provided, as well as details on the main technological approaches that are developed. Strengths and weaknesses will also be detailed.

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12:35 - 13:00 

Emerging Material Integration for Advanced Functionality of Semiconductor Devices and Systems

Hiroyuki Akinaga (AIST, JP)

In my presentation, integration technologies of emerging materials bringing advanced and diversified functionalities to semiconductor devices and systems are reviewed. As specific examples, in the field of Beyond CMOS, I will introduce case studies of nonvolatile memory incorporating functional oxides and reservoir computing using ionic liquids. In the More-than-Moore field, the advances of energy harvesting technologies are shown. In order to implement emerging materials with novel functions into society, it is essential to create a healthy development competitive environment and market environment through international standardization. I will introduce examples of international standardization in the field of nanoelectronics.​​​